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| CXG1034TN Receiving Mixer Description The CXG1034TN is a receiving mixer MMIC. This IC is designed using the Sony's GaAs J-FET process. Features * Low distortion Input IP3=+1.5 dBm (Typ.) * Low LO input power operation PLO=-15 dBm * RF, LO input matching circuit * Single 3 V power supply operation * 10-pin TSSOP package Function Frequency conversion Applications Japan digital cordless telephones (PHS) Structure GaAs J-FET MMIC 10 pin TSSOP (Plastic) Absolute Maximum Ratings (Ta=25 C) * Supply voltage VDD 4.5 V * Input power PIN +5 dBm * Operating temperature Topr -35 to +85 C * Storage temperature Tstg -65 to +150 C Operating Conditions Supply voltage VDD 3.0 V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- E97Z04-TE CXG1034TN Electrical Characteristics VDD=3.0 V, fRF=1.9 GHz, fLO=1.66 GHz, PLO=-15 dBm, when 50 IF output matching; unless otherwise specified (Ta=25 C) Item Current consumption Conversion gain Noise figure Input IP3 LO to RF leak level RF input VSWR LO input VSWR Symbol IDD Gc NF IIP3 PLK VSWRRF VSWRLO Min. -- 7 -- -1.5 -- -- -- Typ. 5 8 8.5 1.5 -19 1.5 2 Max. 7 10 10.5 -- -14 2.5 3.5 Unit mA dB dB dBm dBm -- -- Measurement condition When no signal Block Diagram RFIN MIX IF AMP IFOUT LOIN LO AMP Pin Configuration NC RFIN GND NC VDD (LO AMP) 10 1 IF OUT/VDD (MIX, IF AMP) CAP GND CAP LOIN 10-pin TSSOP (Plastic) --2-- CXG1034TN Recommended Evaluation Circuit C5 VDD (MIX, IF AMP) L1 C4 6 RFIN 50 5 4 3 2 1 C3 C6 IF OUT 50 7 8 9 VDD (LO AMP) C2 C1 10 LOIN 50 L1 C1 C2 C3 C4 C5 C6 56 nH 18 pF 1000 pF 18 pF 8 pF 1000 pF 0.1 F --3-- CXG1034TN Example of Representative Characteristics (Ta=25 C) POUT, IM3 vs. PIN 20 0 POUT POUT-IF output power (dBm) -20 -40 IM3 VDD=3.0V fRF1=1.90GHz fRF2=1.9006GHz fLO=1.66GHz PLO=-15dBm -60 -80 -35 -25 -15 -5 PIN-RF input power (dBm) 5 Gc, NF vs. PLO 10 Gc 8 13 2 15 4 IIP3, PLK vs. PLO -5 IIP3 -10 6 VDD=3.0V fRF=1.90GHz fLO=1.66GHz 11 0 PLK -2 VDD=3.0V fRF=1.90GHz fLO=1.66GHz -4 -15 4 NF 2 9 -20 7 -25 0 -25 -20 -15 -10 PLO-LO input power (dBm) -5 0 5 -6 -25 -20 -15 -10 PLO-LO input power (dBm) -5 0 -30 --4-- PLK-LO-RF leak level (dBm) Gc-Conversion gain (dB) NF-Noise figure (dB) IIP3-Input IP3 (dBm) CXG1034TN Recommended Evaluation Board Front 25mm SONY CXG1034TN EVB IFOUT C4 RFIN C1 L1 C6 C3 C5 LOIN C2 VDD (LO AMP) GND VDD (MIX, IF AMP) Back VDD (MIX, IF AMP) GND VDD (LO AMP) Glass fabric-base 4-layer epoxy board (thickness: 0.3 mm x 2) GND for the 2nd and 3rd layers --5-- CXG1034TN Package Outline Unit : mm 10PIN TSSOP(PLASTIC) 1.2MAX 2.8 0.1 10 6 0.1 2.2 0.1 + 0.15 0.1 - 0.05 3.2 0.2 1 5 0.5 0.25 0 to 10 + 0.08 0.22 - 0.07 0.1 M (0.2) + 0.08 0.22 - 0.07 DETAIL A NOTE: Dimension "" does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-10P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.02g --6-- (0.1) + 0.025 0.12 - 0.015 A 0.45 0.15 |
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